Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 25, 2019 CVE-2019-2312 HIGH
7.8
2 Jul 25, 2019 CVE-2019-2308 HIGH
7.8
3 Jul 25, 2019 CVE-2019-2307 CRITICAL
9.8
4 Jul 25, 2019 CVE-2019-2306 HIGH
7.8
5 Jul 25, 2019 CVE-2019-2305 CRITICAL
9.8
6 Jul 25, 2019 CVE-2019-2293 HIGH
7.8
7 Jul 25, 2019 CVE-2019-2281 HIGH
7.8
8 Jul 25, 2019 CVE-2019-2276 CRITICAL
9.8
9 Jul 25, 2019 CVE-2019-2254 CRITICAL
9.8
10 Jul 25, 2019 CVE-2019-2253 CRITICAL
9.8
11 Jul 25, 2019 CVE-2019-2241 MEDIUM
5.5
12 Jul 25, 2019 CVE-2019-2240 MEDIUM
5.5
13 Jul 25, 2019 CVE-2019-2239 MEDIUM
5.5
14 Jul 25, 2019 CVE-2019-2236 MEDIUM
5.5
15 Jul 25, 2019 CVE-2019-2235 HIGH
7.8
16 Jul 25, 2019 CVE-2018-13897 HIGH
7.5
17 Jul 22, 2019 CVE-2019-2292 HIGH
7.8
18 Jul 22, 2019 CVE-2019-2287 CRITICAL
9.8
19 Jul 22, 2019 CVE-2019-2279 CRITICAL
9.8
20 Jul 22, 2019 CVE-2019-2277 HIGH
7.8
Showing 20 of 553 Results
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