Product Detail

EXYNOS 850 FIRMWARE

https://semiconductor.samsung.com/processor/mobile-processor/

Vendor :

Samsung

Number of CVE:

73

Average Exploit Prediction Score :

0.30

Public Exploit/PoC Code :

3

CISA Actively Exploited :

0

Last Vulnerability Seen :

Nov. 04, 2025
Vulnerabilities

The following vulnerabilities are recorded EXYNOS 850 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 13, 2025 CVE-2024-46920 MEDIUM
6.5
2 Jan 13, 2025 CVE-2024-48883 MEDIUM
4.3
3 Jan 13, 2025 CVE-2024-46919 MEDIUM
5.3
4 Dec 02, 2024 CVE-2024-39890 HIGH
8.1
5 Nov 04, 2024 CVE-2024-45185 MEDIUM
5.1
6 Oct 11, 2024 CVE-2024-45184 MEDIUM
6.2
7 Oct 07, 2024 CVE-2024-44068 HIGH
8.1
8 Sep 10, 2024 CVE-2024-25074 MEDIUM
5.9
9 Sep 10, 2024 CVE-2024-25073 MEDIUM
5.9
10 Sep 09, 2024 CVE-2024-27365 MEDIUM
5.5
11 Sep 09, 2024 CVE-2024-27387 HIGH
7.8
12 Sep 09, 2024 CVE-2024-27383 HIGH
7.8
13 Sep 09, 2024 CVE-2024-27368 MEDIUM
5.5
14 Sep 09, 2024 CVE-2024-27367 MEDIUM
5.5
15 Sep 09, 2024 CVE-2024-27366 MEDIUM
5.5
16 Sep 09, 2024 CVE-2024-27364 MEDIUM
5.5
17 Jul 09, 2024 CVE-2024-29153 HIGH
8.1
18 Jul 09, 2024 CVE-2024-28068 MEDIUM
5.3
19 Jul 09, 2024 CVE-2023-50806 HIGH
8.4
20 Jul 09, 2024 CVE-2023-50805 HIGH
8.1
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