Product Detail
EXYNOS 850 FIRMWARE
https://semiconductor.samsung.com/processor/mobile-processor/
Public Exploit/PoC Code :
3
CISA Actively Exploited :
0
Last Vulnerability Seen :
Sep. 02, 2025
Vulnerabilities
The following vulnerabilities are recorded
EXYNOS 850 FIRMWARE product. You can click on the
vulnerability to view more details.
| Number | Published | CVE ID | Severity | CVSS Score | |
|---|---|---|---|---|---|
| 1 | Mar 13, 2023 | CVE-2023-26073 | CRITICAL |
9.8
|
|
| 2 | Mar 13, 2023 | CVE-2023-26074 | CRITICAL |
9.8
|
|
| 3 | Mar 13, 2023 | CVE-2023-26072 | CRITICAL |
9.8
|
|
| 4 | Mar 10, 2023 | CVE-2023-26075 | CRITICAL |
9.8
|