Product Detail

EXYNOS 850 FIRMWARE

https://semiconductor.samsung.com/processor/mobile-processor/

Vendor :

Samsung

Number of CVE:

76

Average Exploit Prediction Score :

0.30

Public Exploit/PoC Code :

3

CISA Actively Exploited :

0

Last Vulnerability Seen :

Jan. 05, 2026
Vulnerabilities

The following vulnerabilities are recorded EXYNOS 850 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 05, 2024 CVE-2023-50804 MEDIUM
5.3
2 Jun 05, 2024 CVE-2023-50803 MEDIUM
5.3
3 Jun 05, 2024 CVE-2023-49928 HIGH
7.5
4 Jun 05, 2024 CVE-2023-49927 MEDIUM
5.3
5 Jun 04, 2024 CVE-2024-29152 HIGH
7.5
6 Dec 13, 2023 CVE-2023-43122 MEDIUM
4.8
7 Nov 08, 2023 CVE-2023-41112 HIGH
7.5
8 Nov 08, 2023 CVE-2023-41111 HIGH
7.5
9 Sep 08, 2023 CVE-2023-37377 HIGH
7.5
10 Sep 08, 2023 CVE-2023-37368 HIGH
7.5
11 Sep 08, 2023 CVE-2023-37367 MEDIUM
5.3
12 Aug 28, 2023 CVE-2023-36481 HIGH
7.5
13 Mar 13, 2023 CVE-2023-26073 CRITICAL
9.8
14 Mar 13, 2023 CVE-2023-26074 CRITICAL
9.8
15 Mar 13, 2023 CVE-2023-26072 CRITICAL
9.8
16 Mar 10, 2023 CVE-2023-26075 CRITICAL
9.8
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