Product Detail

EXYNOS 850 FIRMWARE

https://semiconductor.samsung.com/processor/mobile-processor/

Vendor :

Samsung

Number of CVE:

76

Average Exploit Prediction Score :

0.30

Public Exploit/PoC Code :

3

CISA Actively Exploited :

0

Last Vulnerability Seen :

Jan. 05, 2026
Vulnerabilities

The following vulnerabilities are recorded EXYNOS 850 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 09, 2024 CVE-2024-28068 MEDIUM
5.3
2 Jul 09, 2024 CVE-2023-50806 HIGH
8.4
3 Jul 09, 2024 CVE-2023-50805 HIGH
8.1
4 Jul 09, 2024 CVE-2024-27360 HIGH
7.5
5 Jun 13, 2024 CVE-2024-32504 HIGH
8.4
6 Jun 07, 2024 CVE-2024-32502 HIGH
8.4
7 Jun 07, 2024 CVE-2024-32503 HIGH
8.4
8 Jun 05, 2024 CVE-2024-27382 HIGH
7.1
9 Jun 05, 2024 CVE-2024-27381 MEDIUM
6.0
10 Jun 05, 2024 CVE-2024-27380 MEDIUM
6.0
11 Jun 05, 2024 CVE-2024-27379 HIGH
7.8
12 Jun 05, 2024 CVE-2024-27378 HIGH
7.1
13 Jun 05, 2024 CVE-2024-27377 HIGH
7.8
14 Jun 05, 2024 CVE-2024-27376 HIGH
7.8
15 Jun 05, 2024 CVE-2024-27375 HIGH
7.8
16 Jun 05, 2024 CVE-2024-27374 HIGH
7.8
17 Jun 05, 2024 CVE-2024-27373 HIGH
7.8
18 Jun 05, 2024 CVE-2024-27372 HIGH
8.4
19 Jun 05, 2024 CVE-2024-27371 HIGH
7.8
20 Jun 05, 2024 CVE-2024-27370 HIGH
7.8
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