Product Detail

EXYNOS 850 FIRMWARE

https://semiconductor.samsung.com/processor/mobile-processor/

Vendor :

Samsung

Number of CVE:

97

Average Exploit Prediction Score :

0.36

Public Exploit/PoC Code :

9

CISA Actively Exploited :

0

Last Vulnerability Seen :

Apr. 07, 2026
Vulnerabilities

The following vulnerabilities are recorded EXYNOS 850 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 May 14, 2025 CVE-2025-26784 MEDIUM
6.5
2 Mar 06, 2025 CVE-2024-50600 HIGH
7.5
3 Mar 06, 2025 CVE-2024-52924 HIGH
7.5
4 Mar 06, 2025 CVE-2024-52923 HIGH
7.5
5 Jan 13, 2025 CVE-2024-46920 MEDIUM
6.5
6 Jan 13, 2025 CVE-2024-48883 MEDIUM
4.3
7 Jan 13, 2025 CVE-2024-46919 MEDIUM
5.3
8 Dec 02, 2024 CVE-2024-39890 HIGH
8.1
9 Nov 04, 2024 CVE-2024-45185 MEDIUM
5.1
10 Oct 11, 2024 CVE-2024-45184 MEDIUM
6.2
11 Oct 07, 2024 CVE-2024-44068 HIGH
8.1
12 Sep 10, 2024 CVE-2024-25074 MEDIUM
5.9
13 Sep 10, 2024 CVE-2024-25073 MEDIUM
5.9
14 Sep 09, 2024 CVE-2024-27365 MEDIUM
5.5
15 Sep 09, 2024 CVE-2024-27387 HIGH
7.8
16 Sep 09, 2024 CVE-2024-27383 HIGH
7.8
17 Sep 09, 2024 CVE-2024-27368 MEDIUM
5.5
18 Sep 09, 2024 CVE-2024-27367 MEDIUM
5.5
19 Sep 09, 2024 CVE-2024-27366 MEDIUM
5.5
20 Sep 09, 2024 CVE-2024-27364 MEDIUM
5.5
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