Product Detail
EXYNOS 850 FIRMWARE
https://semiconductor.samsung.com/processor/mobile-processor/
Product Intelligence
Public Exploit/PoC Code :
11
CISA Actively Exploited :
0
Last Vulnerability Seen :
Sep. 14, 2026
Vulnerabilities
The following vulnerabilities are recorded
EXYNOS 850 FIRMWARE product. You can click on the
vulnerability to view more details.
| Number | Published | CVE ID | Severity | CVSS Score | |
|---|---|---|---|---|---|
| 1 | Mar 10, 2023 | CVE-2023-26075 | CRITICAL |
9.8
|