Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

34

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 12, 2023 CVE-2022-33306 HIGH
7.5
2 Feb 12, 2023 CVE-2022-33277 HIGH
8.4
3 Feb 12, 2023 CVE-2022-33271 HIGH
8.2
4 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
5 Feb 12, 2023 CVE-2022-33246 HIGH
7.8
6 Feb 12, 2023 CVE-2022-33243 HIGH
8.4
7 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
8 Feb 12, 2023 CVE-2022-33232 CRITICAL
9.3
9 Feb 12, 2023 CVE-2022-33225 HIGH
7.8
10 Jan 09, 2023 CVE-2022-40520 HIGH
8.4
11 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
12 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
13 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
14 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
15 Jan 09, 2023 CVE-2022-33300 HIGH
8.4
16 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
17 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
18 Jan 09, 2023 CVE-2022-33284 HIGH
8.2
19 Jan 09, 2023 CVE-2022-33283 HIGH
8.2
20 Jan 09, 2023 CVE-2022-33276 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 22, 2024 19:39