Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

32

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-33266 HIGH
7.8
2 Jan 09, 2023 CVE-2022-33255 HIGH
8.2
3 Jan 09, 2023 CVE-2022-33253 HIGH
7.5
4 Jan 09, 2023 CVE-2022-33252 HIGH
8.2
5 Jan 09, 2023 CVE-2022-25746 HIGH
8.1
6 Jan 09, 2023 CVE-2022-25725 MEDIUM
6.2
7 Jan 09, 2023 CVE-2022-22088 CRITICAL
9.8
8 Dec 13, 2022 CVE-2022-33268 HIGH
8.2
9 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
10 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
11 Dec 13, 2022 CVE-2022-25712 HIGH
7.8
12 Dec 13, 2022 CVE-2022-25711 HIGH
7.8
13 Dec 13, 2022 CVE-2022-25702 HIGH
7.5
14 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
15 Dec 13, 2022 CVE-2022-25692 HIGH
7.5
16 Dec 13, 2022 CVE-2022-25685 HIGH
7.5
17 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
18 Dec 13, 2022 CVE-2022-25681 HIGH
8.4
19 Dec 13, 2022 CVE-2022-25677 HIGH
7.8
20 Dec 13, 2022 CVE-2022-25675 MEDIUM
5.5
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