Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Nov 15, 2022 CVE-2022-33239 HIGH
7.5
2 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
3 Nov 15, 2022 CVE-2022-33236 HIGH
7.5
4 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
5 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
6 Nov 15, 2022 CVE-2022-25741 HIGH
7.5
7 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
8 Nov 15, 2022 CVE-2022-25679 MEDIUM
6.2
9 Nov 15, 2022 CVE-2022-25676 MEDIUM
6.8
10 Oct 19, 2022 CVE-2022-33214 HIGH
8.4
11 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
12 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
13 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
14 Oct 19, 2022 CVE-2022-25720 CRITICAL
9.8
15 Oct 19, 2022 CVE-2022-25687 CRITICAL
9.8
16 Oct 19, 2022 CVE-2022-25666 MEDIUM
6.7
17 Oct 19, 2022 CVE-2022-25665 HIGH
7.1
18 Oct 19, 2022 CVE-2022-25664 MEDIUM
6.2
19 Oct 19, 2022 CVE-2022-25662 HIGH
7.5
20 Oct 19, 2022 CVE-2022-25661 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 3:47