Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

399

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

48

CISA Actively Exploited :

4

Last Vulnerability Seen :

Oct. 06, 2026
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 06, 2023 CVE-2022-40523 HIGH
7.1
2 Jun 06, 2023 CVE-2022-40521 HIGH
7.5
3 Jun 06, 2023 CVE-2022-40507 HIGH
8.4
4 Jun 06, 2023 CVE-2022-33264 HIGH
7.9
5 Jun 06, 2023 CVE-2022-22076 HIGH
7.1
6 May 02, 2023 CVE-2022-40504 HIGH
7.5
7 Apr 13, 2023 CVE-2022-40532 HIGH
8.4
8 Apr 13, 2023 CVE-2022-33302 HIGH
7.8
9 Apr 13, 2023 CVE-2022-33289 MEDIUM
6.8
10 Apr 13, 2023 CVE-2022-33231 CRITICAL
9.3
11 Mar 10, 2023 CVE-2022-40537 CRITICAL
9.8
12 Mar 10, 2023 CVE-2022-40535 HIGH
7.5
13 Mar 10, 2023 CVE-2022-40531 HIGH
8.4
14 Mar 10, 2023 CVE-2022-40515 CRITICAL
9.8
15 Mar 10, 2023 CVE-2022-33278 HIGH
7.8
16 Mar 10, 2023 CVE-2022-33257 CRITICAL
9.3
17 Mar 10, 2023 CVE-2022-33242 HIGH
7.8
18 Mar 10, 2023 CVE-2022-33213 HIGH
8.8
19 Mar 10, 2023 CVE-2022-25705 HIGH
7.8
20 Mar 10, 2023 CVE-2022-25694 HIGH
8.4
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