Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
2 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
3 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
4 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
5 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
6 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
7 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
8 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
9 Oct 19, 2022 CVE-2022-25718 CRITICAL
9.8
10 Sep 16, 2022 CVE-2022-25706 HIGH
8.2
11 Sep 16, 2022 CVE-2022-25690 HIGH
7.5
12 Sep 16, 2022 CVE-2022-25688 CRITICAL
9.8
13 Sep 16, 2022 CVE-2022-25686 CRITICAL
9.8
14 Sep 16, 2022 CVE-2022-22091 HIGH
7.5
15 Sep 16, 2022 CVE-2022-22074 HIGH
8.4
16 Sep 02, 2022 CVE-2022-25668 CRITICAL
9.8
17 Sep 02, 2022 CVE-2022-25659 CRITICAL
9.8
18 Sep 02, 2022 CVE-2022-25658 CRITICAL
9.8
19 Sep 02, 2022 CVE-2022-25657 CRITICAL
9.8
20 Sep 02, 2022 CVE-2022-22070 HIGH
7.8
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Latest DB Update: Nov. 22, 2024 20:03