Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

554

Average Exploit Prediction Score :

0.29

Public Exploit/PoC Code :

34

CISA Actively Exploited :

3

Last Vulnerability Seen :

Nov. 26, 2024
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
2 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
3 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
4 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
5 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
6 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
7 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
8 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
9 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
10 Oct 19, 2022 CVE-2022-25718 CRITICAL
9.8
11 Sep 16, 2022 CVE-2022-25706 HIGH
8.2
12 Sep 16, 2022 CVE-2022-25690 HIGH
7.5
13 Sep 16, 2022 CVE-2022-25688 CRITICAL
9.8
14 Sep 16, 2022 CVE-2022-25686 CRITICAL
9.8
15 Sep 16, 2022 CVE-2022-22091 HIGH
7.5
16 Sep 16, 2022 CVE-2022-22074 HIGH
8.4
17 Sep 02, 2022 CVE-2022-25668 CRITICAL
9.8
18 Sep 02, 2022 CVE-2022-25659 CRITICAL
9.8
19 Sep 02, 2022 CVE-2022-25658 CRITICAL
9.8
20 Sep 02, 2022 CVE-2022-25657 CRITICAL
9.8
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Latest DB Update: Apr. 01, 2025 13:26