Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Oct 20, 2021 CVE-2021-30297 HIGH
8.4
2 Oct 20, 2021 CVE-2021-30292 HIGH
8.4
3 Oct 20, 2021 CVE-2021-30291 HIGH
8.4
4 Oct 20, 2021 CVE-2021-30258 HIGH
8.4
5 Oct 20, 2021 CVE-2021-30257 HIGH
8.4
6 Oct 20, 2021 CVE-2021-30256 HIGH
8.4
7 Oct 20, 2021 CVE-2021-1985 HIGH
8.4
8 Oct 20, 2021 CVE-2021-1984 HIGH
8.4
9 Oct 20, 2021 CVE-2021-1983 HIGH
8.4
10 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
11 Oct 20, 2021 CVE-2021-1959 HIGH
7.8
12 Oct 20, 2021 CVE-2021-1949 HIGH
8.4
13 Oct 20, 2021 CVE-2021-1936 HIGH
7.5
14 Oct 20, 2021 CVE-2021-1917 HIGH
8.4
15 Sep 17, 2021 CVE-2021-30261 HIGH
8.4
16 Sep 17, 2021 CVE-2021-30260 HIGH
8.4
17 Sep 17, 2021 CVE-2021-1976 CRITICAL
9.8
18 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
19 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
20 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
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