Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 02, 2022 CVE-2022-22062 CRITICAL
9.1
2 Sep 02, 2022 CVE-2022-22059 HIGH
8.4
3 Sep 02, 2022 CVE-2021-35135 MEDIUM
6.2
4 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
5 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
6 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
7 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
8 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
9 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
10 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
11 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
12 Nov 12, 2021 CVE-2021-30284 CRITICAL
9.1
13 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
14 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
15 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
16 Nov 12, 2021 CVE-2021-1979 HIGH
7.8
17 Nov 12, 2021 CVE-2021-1975 CRITICAL
9.8
18 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
19 Nov 12, 2021 CVE-2021-1924 CRITICAL
9.0
20 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
Showing 20 of 553 Results
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