Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
2 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
3 Sep 09, 2021 CVE-2021-1933 CRITICAL
9.8
4 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
5 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
6 Sep 08, 2021 CVE-2021-1920 CRITICAL
9.8
7 Sep 08, 2021 CVE-2021-1919 CRITICAL
9.8
8 Sep 08, 2021 CVE-2021-1916 CRITICAL
9.8
9 Sep 08, 2021 CVE-2021-1914 HIGH
7.5
10 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
11 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
12 Sep 08, 2021 CVE-2020-11264 CRITICAL
9.8
13 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
14 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
15 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
16 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
17 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
18 Jul 13, 2021 CVE-2021-1943 HIGH
7.5
19 Jul 13, 2021 CVE-2021-1938 HIGH
7.5
20 Jul 13, 2021 CVE-2021-1931 MEDIUM
6.7
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:45