Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 13, 2021 CVE-2021-1907 HIGH
7.5
2 Jul 13, 2021 CVE-2021-1890 HIGH
8.4
3 Jul 13, 2021 CVE-2021-1889 HIGH
8.4
4 Jul 13, 2021 CVE-2021-1888 HIGH
8.4
5 Jul 13, 2021 CVE-2021-1886 HIGH
8.4
6 Jul 13, 2021 CVE-2020-11307 CRITICAL
9.8
7 Jun 09, 2021 CVE-2021-1937 HIGH
7.5
8 Jun 09, 2021 CVE-2021-1900 HIGH
8.4
9 Jun 09, 2021 CVE-2020-11304 HIGH
7.8
10 Jun 09, 2021 CVE-2020-11292 HIGH
7.8
11 Jun 09, 2021 CVE-2020-11267 HIGH
8.4
12 Jun 09, 2021 CVE-2020-11262 HIGH
7.0
13 Jun 09, 2021 CVE-2020-11261 HIGH
7.8
14 Jun 09, 2021 CVE-2020-11239 HIGH
7.8
15 Jun 09, 2021 CVE-2020-11238 HIGH
7.5
16 Jun 09, 2021 CVE-2020-11235 HIGH
7.8
17 Jun 09, 2021 CVE-2020-11159 CRITICAL
9.1
18 Jun 09, 2021 CVE-2020-11126 CRITICAL
9.1
19 May 07, 2021 CVE-2021-1925 HIGH
7.5
20 May 07, 2021 CVE-2021-1915 HIGH
7.8
SEVERITY DISTRIBUTION CHART