Product Detail

SM7325P FIRMWARE

Vendor :

Qualcomm

Number of CVE:

334

Average Exploit Prediction Score :

0.07

Public Exploit/PoC Code :

35

CISA Actively Exploited :

4

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SM7325P FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22057 HIGH
8.4
2 Jun 14, 2022 CVE-2021-35130 HIGH
8.4
3 Jun 14, 2022 CVE-2021-35126 HIGH
8.4
4 Jun 14, 2022 CVE-2021-35123 HIGH
8.8
5 Jun 14, 2022 CVE-2021-35116 HIGH
7.7
6 Jun 14, 2022 CVE-2021-35112 HIGH
8.4
7 Jun 14, 2022 CVE-2021-35104 CRITICAL
9.8
8 Jun 14, 2022 CVE-2021-35100 HIGH
7.5
9 Jun 14, 2022 CVE-2021-35098 MEDIUM
6.7
10 Jun 14, 2022 CVE-2021-35094 HIGH
7.8
11 Jun 14, 2022 CVE-2021-35092 MEDIUM
6.7
12 Jun 14, 2022 CVE-2021-35090 CRITICAL
9.3
13 Jun 14, 2022 CVE-2021-35086 HIGH
7.5
14 Jun 14, 2022 CVE-2021-35085 HIGH
7.1
15 Jun 14, 2022 CVE-2021-35084 HIGH
7.1
16 Jun 14, 2022 CVE-2021-35081 CRITICAL
9.8
17 Jun 14, 2022 CVE-2021-35079 MEDIUM
6.2
18 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
19 Jun 14, 2022 CVE-2021-35076 HIGH
7.5
20 Jun 14, 2022 CVE-2021-35073 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:56