Product Detail

SM7325P FIRMWARE

Vendor :

Qualcomm

Number of CVE:

334

Average Exploit Prediction Score :

0.07

Public Exploit/PoC Code :

35

CISA Actively Exploited :

4

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SM7325P FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-35071 MEDIUM
5.5
2 Jun 14, 2022 CVE-2021-30350 HIGH
8.4
3 Jun 14, 2022 CVE-2021-30349 HIGH
8.2
4 Jun 14, 2022 CVE-2021-30347 CRITICAL
9.1
5 Jun 14, 2022 CVE-2021-30344 HIGH
7.5
6 Jun 14, 2022 CVE-2021-30343 CRITICAL
9.1
7 Jun 14, 2022 CVE-2021-30341 CRITICAL
9.8
8 Jun 14, 2022 CVE-2021-30340 HIGH
7.5
9 Jun 14, 2022 CVE-2021-30339 CRITICAL
9.0
10 Jun 14, 2022 CVE-2021-30334 HIGH
8.4
11 Jun 14, 2022 CVE-2021-30281 HIGH
8.4
12 Apr 01, 2022 CVE-2021-35117 CRITICAL
9.1
13 Apr 01, 2022 CVE-2021-35106 HIGH
7.8
14 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
15 Apr 01, 2022 CVE-2021-35103 HIGH
7.8
16 Apr 01, 2022 CVE-2021-35088 CRITICAL
9.1
17 Apr 01, 2022 CVE-2021-30333 HIGH
7.8
18 Apr 01, 2022 CVE-2021-30332 HIGH
7.5
19 Apr 01, 2022 CVE-2021-30331 MEDIUM
5.5
20 Apr 01, 2022 CVE-2021-30329 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:58