Product Detail

SM7325P FIRMWARE

Vendor :

Qualcomm

Number of CVE:

334

Average Exploit Prediction Score :

0.07

Public Exploit/PoC Code :

35

CISA Actively Exploited :

4

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SM7325P FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Apr 01, 2022 CVE-2021-1950 HIGH
7.8
2 Apr 01, 2022 CVE-2021-1942 CRITICAL
9.3
3 Feb 11, 2022 CVE-2021-35077 HIGH
8.4
4 Feb 11, 2022 CVE-2021-35075 HIGH
8.4
5 Feb 11, 2022 CVE-2021-35069 HIGH
7.8
6 Feb 11, 2022 CVE-2021-35068 CRITICAL
9.8
7 Feb 11, 2022 CVE-2021-30326 HIGH
7.5
8 Feb 11, 2022 CVE-2021-30322 HIGH
7.8
9 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
10 Feb 11, 2022 CVE-2021-30317 CRITICAL
9.3
11 Jan 13, 2022 CVE-2021-30353 HIGH
7.5
12 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
13 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
14 Jan 13, 2022 CVE-2021-30314 MEDIUM
6.2
15 Jan 13, 2022 CVE-2021-30313 MEDIUM
6.7
16 Jan 13, 2022 CVE-2021-30311 HIGH
7.8
17 Jan 13, 2022 CVE-2021-30307 HIGH
7.5
18 Jan 13, 2022 CVE-2021-30285 CRITICAL
9.3
19 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
20 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
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Latest DB Update: Nov. 23, 2024 1:32