Product Detail

SM7325P FIRMWARE

Vendor :

Qualcomm

Number of CVE:

334

Average Exploit Prediction Score :

0.07

Public Exploit/PoC Code :

35

CISA Actively Exploited :

4

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SM7325P FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 03, 2022 CVE-2021-30336 HIGH
8.4
2 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
3 Jan 03, 2022 CVE-2021-30283 HIGH
7.1
4 Jan 03, 2022 CVE-2021-30282 HIGH
8.4
5 Jan 03, 2022 CVE-2021-30279 HIGH
7.8
6 Jan 03, 2022 CVE-2021-30278 HIGH
7.1
7 Jan 03, 2022 CVE-2021-30276 CRITICAL
9.3
8 Jan 03, 2022 CVE-2021-30275 CRITICAL
9.3
9 Jan 03, 2022 CVE-2021-30274 HIGH
8.4
10 Jan 03, 2022 CVE-2021-30272 HIGH
7.8
11 Jan 03, 2022 CVE-2021-30270 HIGH
7.8
12 Jan 03, 2022 CVE-2021-30269 HIGH
7.8
13 Jan 03, 2022 CVE-2021-1918 MEDIUM
6.5
14 Jan 03, 2022 CVE-2021-1894 HIGH
7.8
15 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
16 Jul 13, 2021 CVE-2021-1965 CRITICAL
9.8
17 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
18 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
19 Jul 13, 2021 CVE-2021-1954 HIGH
7.5
20 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:58