Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 13, 2021 CVE-2021-1886 HIGH
8.4
2 Jul 13, 2021 CVE-2020-11307 CRITICAL
9.8
3 Jun 09, 2021 CVE-2021-1937 HIGH
7.5
4 Jun 09, 2021 CVE-2021-1900 HIGH
8.4
5 Jun 09, 2021 CVE-2020-11304 HIGH
7.8
6 Jun 09, 2021 CVE-2020-11298 HIGH
7.8
7 Jun 09, 2021 CVE-2020-11292 HIGH
7.8
8 Jun 09, 2021 CVE-2020-11291 CRITICAL
9.8
9 Jun 09, 2021 CVE-2020-11267 HIGH
8.4
10 Jun 09, 2021 CVE-2020-11176 CRITICAL
9.8
11 Jun 09, 2021 CVE-2020-11262 HIGH
7.0
12 Jun 09, 2021 CVE-2020-11261 HIGH
7.8
13 Jun 09, 2021 CVE-2020-11260 HIGH
8.4
14 Jun 09, 2021 CVE-2020-11250 HIGH
7.0
15 Jun 09, 2021 CVE-2020-11241 HIGH
7.5
16 Jun 09, 2021 CVE-2020-11240 HIGH
7.8
17 Jun 09, 2021 CVE-2020-11239 HIGH
7.8
18 Jun 09, 2021 CVE-2020-11238 HIGH
7.5
19 Jun 09, 2021 CVE-2020-11235 HIGH
7.8
20 Jun 09, 2021 CVE-2020-11182 CRITICAL
9.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:17