Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

291

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 17, 2021 CVE-2021-30260 HIGH
8.4
2 Sep 17, 2021 CVE-2021-1976 CRITICAL
9.8
3 Sep 17, 2021 CVE-2021-1939 HIGH
8.4
4 Sep 09, 2021 CVE-2021-30295 HIGH
8.4
5 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
6 Sep 09, 2021 CVE-2021-1960 MEDIUM
6.5
7 Sep 09, 2021 CVE-2021-1952 HIGH
7.8
8 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
9 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
10 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
11 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
12 Sep 09, 2021 CVE-2021-1933 CRITICAL
9.8
13 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
14 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
15 Sep 08, 2021 CVE-2021-1930 HIGH
7.1
16 Sep 08, 2021 CVE-2021-1923 HIGH
7.8
17 Sep 08, 2021 CVE-2021-1920 CRITICAL
9.8
18 Sep 08, 2021 CVE-2021-1919 CRITICAL
9.8
19 Sep 08, 2021 CVE-2021-1916 CRITICAL
9.8
20 Sep 08, 2021 CVE-2021-1914 HIGH
7.5
Showing 20 of 291 Results
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