Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

326

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

32

CISA Actively Exploited :

5

Last Vulnerability Seen :

May. 06, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 16, 2022 CVE-2022-25688 CRITICAL
9.8
2 Sep 16, 2022 CVE-2022-25686 CRITICAL
9.8
3 Sep 16, 2022 CVE-2022-25669 HIGH
7.5
4 Sep 16, 2022 CVE-2022-22091 HIGH
7.5
5 Sep 02, 2022 CVE-2022-25668 CRITICAL
9.8
6 Sep 02, 2022 CVE-2022-25659 CRITICAL
9.8
7 Sep 02, 2022 CVE-2022-25658 CRITICAL
9.8
8 Sep 02, 2022 CVE-2022-25657 CRITICAL
9.8
9 Sep 02, 2022 CVE-2022-22070 HIGH
7.8
10 Sep 02, 2022 CVE-2022-22069 HIGH
7.8
11 Sep 02, 2022 CVE-2022-22062 CRITICAL
9.1
12 Sep 02, 2022 CVE-2021-35135 MEDIUM
6.2
13 Sep 02, 2022 CVE-2021-35132 HIGH
8.4
14 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
15 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
16 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
17 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
18 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
19 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
20 Jun 14, 2022 CVE-2022-22072 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Jun. 06, 2025 17:12