Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
2 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
3 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
4 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
5 Oct 20, 2021 CVE-2021-1959 HIGH
7.8
6 Sep 17, 2021 CVE-2021-30261 HIGH
8.4
7 Sep 17, 2021 CVE-2021-30260 HIGH
8.4
8 Sep 17, 2021 CVE-2021-1976 CRITICAL
9.8
9 Sep 17, 2021 CVE-2021-1939 HIGH
8.4
10 Sep 09, 2021 CVE-2021-30295 HIGH
8.4
11 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
12 Sep 09, 2021 CVE-2021-1960 MEDIUM
6.5
13 Sep 09, 2021 CVE-2021-1952 HIGH
7.8
14 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
15 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
16 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
17 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
18 Sep 09, 2021 CVE-2021-1933 CRITICAL
9.8
19 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
20 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:33