Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

291

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
2 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
3 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
4 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
5 Jun 14, 2022 CVE-2022-22072 HIGH
7.8
6 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
7 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
8 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
9 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
10 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
11 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
12 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
13 Nov 12, 2021 CVE-2021-1981 CRITICAL
9.1
14 Nov 12, 2021 CVE-2021-1979 HIGH
7.8
15 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
16 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
17 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
18 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
19 Oct 20, 2021 CVE-2021-1959 HIGH
7.8
20 Sep 17, 2021 CVE-2021-30261 HIGH
8.4
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