Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 02, 2022 CVE-2022-22069 HIGH
7.8
2 Sep 02, 2022 CVE-2022-22062 CRITICAL
9.1
3 Sep 02, 2022 CVE-2021-35135 MEDIUM
6.2
4 Sep 02, 2022 CVE-2021-35132 HIGH
8.4
5 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
6 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
7 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
8 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
9 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
10 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
11 Jun 14, 2022 CVE-2022-22072 HIGH
7.8
12 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
13 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
14 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
15 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
16 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
17 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
18 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
19 Nov 12, 2021 CVE-2021-1981 CRITICAL
9.1
20 Nov 12, 2021 CVE-2021-1979 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:23