Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

333

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

34

CISA Actively Exploited :

5

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
2 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
3 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
4 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
5 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
6 Jan 09, 2023 CVE-2022-25746 HIGH
8.1
7 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
8 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
9 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
10 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
11 Dec 13, 2022 CVE-2022-25681 HIGH
8.4
12 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
13 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
14 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
15 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
16 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
17 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
18 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
19 Oct 19, 2022 CVE-2022-25720 CRITICAL
9.8
20 Oct 19, 2022 CVE-2022-25687 CRITICAL
9.8
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