Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

333

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

34

CISA Actively Exploited :

5

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
2 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
3 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
4 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
5 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
6 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
7 Jun 14, 2022 CVE-2022-22072 HIGH
7.8
8 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
9 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
10 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
11 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
12 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
13 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
14 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
15 Nov 12, 2021 CVE-2021-1981 CRITICAL
9.1
16 Nov 12, 2021 CVE-2021-1979 HIGH
7.8
17 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
18 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
19 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
20 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
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