Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

326

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

32

CISA Actively Exploited :

5

Last Vulnerability Seen :

May. 06, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
2 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
3 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
4 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
5 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
6 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
7 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
8 Nov 12, 2021 CVE-2021-1981 CRITICAL
9.1
9 Nov 12, 2021 CVE-2021-1979 HIGH
7.8
10 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
11 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
12 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
13 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
14 Oct 20, 2021 CVE-2021-1959 HIGH
7.8
15 Sep 17, 2021 CVE-2021-30261 HIGH
8.4
16 Sep 17, 2021 CVE-2021-30260 HIGH
8.4
17 Sep 17, 2021 CVE-2021-1976 CRITICAL
9.8
18 Sep 17, 2021 CVE-2021-1939 HIGH
8.4
19 Sep 09, 2021 CVE-2021-30295 HIGH
8.4
20 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Jun. 07, 2025 3:31