Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 08, 2021 CVE-2021-1930 HIGH
7.1
2 Sep 08, 2021 CVE-2021-1923 HIGH
7.8
3 Sep 08, 2021 CVE-2021-1920 CRITICAL
9.8
4 Sep 08, 2021 CVE-2021-1919 CRITICAL
9.8
5 Sep 08, 2021 CVE-2021-1916 CRITICAL
9.8
6 Sep 08, 2021 CVE-2021-1914 HIGH
7.5
7 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
8 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
9 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
10 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
11 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
12 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
13 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
14 Jul 13, 2021 CVE-2021-1943 HIGH
7.5
15 Jul 13, 2021 CVE-2021-1938 HIGH
7.5
16 Jul 13, 2021 CVE-2021-1931 MEDIUM
6.7
17 Jul 13, 2021 CVE-2021-1907 HIGH
7.5
18 Jul 13, 2021 CVE-2021-1890 HIGH
8.4
19 Jul 13, 2021 CVE-2021-1889 HIGH
8.4
20 Jul 13, 2021 CVE-2021-1888 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:28