Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
2 Feb 12, 2023 CVE-2022-33232 CRITICAL
9.3
3 Jan 09, 2023 CVE-2022-40520 HIGH
8.4
4 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
5 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
6 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
7 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
8 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
9 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
10 Jan 09, 2023 CVE-2022-25746 HIGH
8.1
11 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
12 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
13 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
14 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
15 Dec 13, 2022 CVE-2022-25681 HIGH
8.4
16 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
17 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
18 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
19 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
20 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:40