Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

291

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
2 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
3 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
4 Jan 09, 2023 CVE-2022-25746 HIGH
8.1
5 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
6 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
7 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
8 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
9 Dec 13, 2022 CVE-2022-25681 HIGH
8.4
10 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
11 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
12 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
13 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
14 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
15 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
16 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
17 Oct 19, 2022 CVE-2022-25720 CRITICAL
9.8
18 Oct 19, 2022 CVE-2022-25687 CRITICAL
9.8
19 Oct 19, 2022 CVE-2022-25665 HIGH
7.1
20 Oct 19, 2022 CVE-2022-25661 HIGH
8.4
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