Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

321

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

28

CISA Actively Exploited :

5

Last Vulnerability Seen :

Mar. 03, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 12, 2023 CVE-2022-40512 HIGH
7.5
2 Feb 12, 2023 CVE-2022-33277 HIGH
8.4
3 Feb 12, 2023 CVE-2022-33271 HIGH
8.2
4 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
5 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
6 Feb 12, 2023 CVE-2022-33232 CRITICAL
9.3
7 Jan 09, 2023 CVE-2022-40520 HIGH
8.4
8 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
9 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
10 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
11 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
12 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
13 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
14 Jan 09, 2023 CVE-2022-25746 HIGH
8.1
15 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
16 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
17 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
18 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
19 Dec 13, 2022 CVE-2022-25681 HIGH
8.4
20 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Apr. 03, 2025 14:46