Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
2 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
3 Oct 19, 2022 CVE-2022-25720 CRITICAL
9.8
4 Oct 19, 2022 CVE-2022-25687 CRITICAL
9.8
5 Oct 19, 2022 CVE-2022-25665 HIGH
7.1
6 Oct 19, 2022 CVE-2022-25661 HIGH
8.4
7 Oct 19, 2022 CVE-2022-25660 HIGH
7.8
8 Sep 26, 2022 CVE-2022-22058 HIGH
8.4
9 Sep 16, 2022 CVE-2022-25706 HIGH
8.2
10 Sep 16, 2022 CVE-2022-25696 HIGH
8.4
11 Sep 16, 2022 CVE-2022-25690 HIGH
7.5
12 Sep 16, 2022 CVE-2022-25688 CRITICAL
9.8
13 Sep 16, 2022 CVE-2022-25686 CRITICAL
9.8
14 Sep 16, 2022 CVE-2022-25669 HIGH
7.5
15 Sep 16, 2022 CVE-2022-22091 HIGH
7.5
16 Sep 02, 2022 CVE-2022-25668 CRITICAL
9.8
17 Sep 02, 2022 CVE-2022-25659 CRITICAL
9.8
18 Sep 02, 2022 CVE-2022-25658 CRITICAL
9.8
19 Sep 02, 2022 CVE-2022-25657 CRITICAL
9.8
20 Sep 02, 2022 CVE-2022-22070 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 3:21