Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

291

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Oct 19, 2022 CVE-2022-25660 HIGH
7.8
2 Sep 26, 2022 CVE-2022-22058 HIGH
8.4
3 Sep 16, 2022 CVE-2022-25706 HIGH
8.2
4 Sep 16, 2022 CVE-2022-25696 HIGH
8.4
5 Sep 16, 2022 CVE-2022-25690 HIGH
7.5
6 Sep 16, 2022 CVE-2022-25688 CRITICAL
9.8
7 Sep 16, 2022 CVE-2022-25686 CRITICAL
9.8
8 Sep 16, 2022 CVE-2022-25669 HIGH
7.5
9 Sep 16, 2022 CVE-2022-22091 HIGH
7.5
10 Sep 02, 2022 CVE-2022-25668 CRITICAL
9.8
11 Sep 02, 2022 CVE-2022-25659 CRITICAL
9.8
12 Sep 02, 2022 CVE-2022-25658 CRITICAL
9.8
13 Sep 02, 2022 CVE-2022-25657 CRITICAL
9.8
14 Sep 02, 2022 CVE-2022-22070 HIGH
7.8
15 Sep 02, 2022 CVE-2022-22069 HIGH
7.8
16 Sep 02, 2022 CVE-2022-22062 CRITICAL
9.1
17 Sep 02, 2022 CVE-2021-35135 MEDIUM
6.2
18 Sep 02, 2022 CVE-2021-35132 HIGH
8.4
19 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
20 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
Showing 20 of 291 Results
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