Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Apr 13, 2023 CVE-2022-33289 MEDIUM
6.8
2 Apr 13, 2023 CVE-2022-33288 CRITICAL
9.3
3 Apr 13, 2023 CVE-2022-33269 CRITICAL
9.3
4 Apr 13, 2023 CVE-2022-33231 CRITICAL
9.3
5 Mar 10, 2023 CVE-2022-40537 CRITICAL
9.8
6 Mar 10, 2023 CVE-2022-40531 HIGH
8.4
7 Mar 10, 2023 CVE-2022-40515 CRITICAL
9.8
8 Mar 10, 2023 CVE-2022-33278 HIGH
7.8
9 Mar 10, 2023 CVE-2022-33257 CRITICAL
9.3
10 Mar 10, 2023 CVE-2022-33242 HIGH
7.8
11 Mar 10, 2023 CVE-2022-33213 HIGH
8.8
12 Mar 10, 2023 CVE-2022-25705 HIGH
7.8
13 Mar 10, 2023 CVE-2022-25694 HIGH
8.4
14 Mar 10, 2023 CVE-2022-25655 HIGH
8.4
15 Mar 10, 2023 CVE-2022-22075 MEDIUM
6.2
16 Feb 12, 2023 CVE-2022-40514 CRITICAL
9.8
17 Feb 12, 2023 CVE-2022-40512 HIGH
7.5
18 Feb 12, 2023 CVE-2022-33277 HIGH
8.4
19 Feb 12, 2023 CVE-2022-33271 HIGH
8.2
20 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 0:09