Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

392

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

37

CISA Actively Exploited :

4

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 09, 2021 CVE-2021-1961 MEDIUM
6.7
2 Sep 09, 2021 CVE-2021-1960 MEDIUM
6.5
3 Sep 09, 2021 CVE-2021-1952 HIGH
7.8
4 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
5 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
6 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
7 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
8 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
9 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
10 Sep 08, 2021 CVE-2021-1930 HIGH
7.1
11 Sep 08, 2021 CVE-2021-1929 MEDIUM
6.2
12 Sep 08, 2021 CVE-2021-1923 HIGH
7.8
13 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
14 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
15 Sep 08, 2021 CVE-2020-11264 CRITICAL
9.8
16 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
17 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
18 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
19 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
20 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
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