Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
2 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
3 Sep 08, 2021 CVE-2020-11264 CRITICAL
9.8
4 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
5 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
6 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
7 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
8 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
9 Jul 13, 2021 CVE-2021-1943 HIGH
7.5
10 Jul 13, 2021 CVE-2021-1938 HIGH
7.5
11 Jul 13, 2021 CVE-2021-1931 MEDIUM
6.7
12 Jul 13, 2021 CVE-2021-1890 HIGH
8.4
13 Jul 13, 2021 CVE-2021-1889 HIGH
8.4
14 Jul 13, 2021 CVE-2021-1888 HIGH
8.4
15 Jul 13, 2021 CVE-2021-1886 HIGH
8.4
16 Jul 13, 2021 CVE-2020-11307 CRITICAL
9.8
17 Jun 09, 2021 CVE-2021-1937 HIGH
7.5
18 Jun 09, 2021 CVE-2020-11306 HIGH
7.8
19 Jun 09, 2021 CVE-2020-11304 HIGH
7.8
20 Jun 09, 2021 CVE-2020-11298 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:38