Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
2 Oct 20, 2021 CVE-2021-30312 HIGH
7.5
3 Oct 20, 2021 CVE-2021-30306 HIGH
8.4
4 Oct 20, 2021 CVE-2021-30297 HIGH
8.4
5 Oct 20, 2021 CVE-2021-30292 HIGH
8.4
6 Oct 20, 2021 CVE-2021-30291 HIGH
8.4
7 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
8 Oct 20, 2021 CVE-2021-30258 HIGH
8.4
9 Oct 20, 2021 CVE-2021-30257 HIGH
8.4
10 Oct 20, 2021 CVE-2021-30256 HIGH
8.4
11 Oct 20, 2021 CVE-2021-1985 HIGH
8.4
12 Oct 20, 2021 CVE-2021-1984 HIGH
8.4
13 Oct 20, 2021 CVE-2021-1983 HIGH
8.4
14 Oct 20, 2021 CVE-2021-1980 CRITICAL
9.1
15 Oct 20, 2021 CVE-2021-1977 CRITICAL
9.1
16 Oct 20, 2021 CVE-2021-1967 MEDIUM
5.3
17 Oct 20, 2021 CVE-2021-1959 HIGH
7.8
18 Oct 20, 2021 CVE-2021-1949 HIGH
8.4
19 Oct 20, 2021 CVE-2021-1936 HIGH
7.5
20 Oct 20, 2021 CVE-2021-1932 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:40