Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

29

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 03, 2022 CVE-2021-30275 CRITICAL
9.3
2 Jan 03, 2022 CVE-2021-30274 HIGH
8.4
3 Jan 03, 2022 CVE-2021-30272 HIGH
7.8
4 Jan 03, 2022 CVE-2021-30271 HIGH
7.8
5 Jan 03, 2022 CVE-2021-30270 HIGH
7.8
6 Jan 03, 2022 CVE-2021-30269 HIGH
7.8
7 Jan 03, 2022 CVE-2021-30268 HIGH
7.8
8 Jan 03, 2022 CVE-2021-30262 HIGH
8.4
9 Jan 03, 2022 CVE-2021-1894 HIGH
7.8
10 Jan 03, 2022 CVE-2020-11263 HIGH
8.2
11 Nov 12, 2021 CVE-2021-30284 CRITICAL
9.1
12 Nov 12, 2021 CVE-2021-30266 MEDIUM
6.7
13 Nov 12, 2021 CVE-2021-30265 MEDIUM
6.7
14 Nov 12, 2021 CVE-2021-30264 MEDIUM
6.7
15 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
16 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
17 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
18 Nov 12, 2021 CVE-2021-1975 CRITICAL
9.8
19 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
20 Nov 12, 2021 CVE-2021-1924 CRITICAL
9.0
Showing 20 of 380 Results
SEVERITY DISTRIBUTION CHART