Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

29

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Oct 20, 2021 CVE-2021-1917 HIGH
8.4
2 Oct 20, 2021 CVE-2021-1913 HIGH
8.4
3 Sep 17, 2021 CVE-2021-30260 HIGH
8.4
4 Sep 17, 2021 CVE-2021-1976 CRITICAL
9.8
5 Sep 17, 2021 CVE-2021-1947 HIGH
8.4
6 Sep 09, 2021 CVE-2021-30295 HIGH
8.4
7 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
8 Sep 09, 2021 CVE-2021-1963 MEDIUM
6.7
9 Sep 09, 2021 CVE-2021-1961 MEDIUM
6.7
10 Sep 09, 2021 CVE-2021-1960 MEDIUM
6.5
11 Sep 09, 2021 CVE-2021-1952 HIGH
7.8
12 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
13 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
14 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
15 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
16 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
17 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
18 Sep 08, 2021 CVE-2021-1930 HIGH
7.1
19 Sep 08, 2021 CVE-2021-1929 MEDIUM
6.2
20 Sep 08, 2021 CVE-2021-1923 HIGH
7.8
Showing 20 of 380 Results
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