Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Dec 13, 2022 CVE-2022-25685 HIGH
7.5
2 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
3 Nov 15, 2022 CVE-2022-33239 HIGH
7.5
4 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
5 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
6 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
7 Nov 15, 2022 CVE-2022-25741 HIGH
7.5
8 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
9 Nov 15, 2022 CVE-2022-25679 MEDIUM
6.2
10 Nov 15, 2022 CVE-2022-25676 MEDIUM
6.8
11 Oct 19, 2022 CVE-2022-33214 HIGH
8.4
12 Oct 19, 2022 CVE-2022-25749 HIGH
7.5
13 Oct 19, 2022 CVE-2022-25748 CRITICAL
9.8
14 Oct 19, 2022 CVE-2022-25736 HIGH
7.5
15 Oct 19, 2022 CVE-2022-25720 CRITICAL
9.8
16 Oct 19, 2022 CVE-2022-25718 CRITICAL
9.8
17 Oct 19, 2022 CVE-2022-25687 CRITICAL
9.8
18 Sep 16, 2022 CVE-2022-25706 HIGH
8.2
19 Sep 16, 2022 CVE-2022-25696 HIGH
8.4
20 Sep 16, 2022 CVE-2022-25690 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 1:25