Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

390

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Mar. 03, 2025
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
2 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
3 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
4 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
5 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
6 Jan 09, 2023 CVE-2022-33284 HIGH
8.2
7 Jan 09, 2023 CVE-2022-22088 CRITICAL
9.8
8 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
9 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
10 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
11 Dec 13, 2022 CVE-2022-25685 HIGH
7.5
12 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
13 Nov 15, 2022 CVE-2022-33239 HIGH
7.5
14 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
15 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
16 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
17 Nov 15, 2022 CVE-2022-25741 HIGH
7.5
18 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
19 Nov 15, 2022 CVE-2022-25679 MEDIUM
6.2
20 Nov 15, 2022 CVE-2022-25676 MEDIUM
6.8
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Latest DB Update: Apr. 03, 2025 1:00