Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

393

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

38

CISA Actively Exploited :

4

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
2 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
3 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
4 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
5 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
6 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
7 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
8 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
9 Jan 09, 2023 CVE-2022-33284 HIGH
8.2
10 Jan 09, 2023 CVE-2022-22088 CRITICAL
9.8
11 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
12 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
13 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
14 Dec 13, 2022 CVE-2022-25685 HIGH
7.5
15 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
16 Nov 15, 2022 CVE-2022-33239 HIGH
7.5
17 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
18 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
19 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
20 Nov 15, 2022 CVE-2022-25741 HIGH
7.5
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