Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 02, 2022 CVE-2021-35135 MEDIUM
6.2
2 Sep 02, 2022 CVE-2021-35132 HIGH
8.4
3 Sep 02, 2022 CVE-2021-35122 CRITICAL
9.3
4 Sep 02, 2022 CVE-2021-35097 HIGH
7.3
5 Jun 14, 2022 CVE-2022-22087 CRITICAL
9.8
6 Jun 14, 2022 CVE-2022-22086 CRITICAL
9.8
7 Jun 14, 2022 CVE-2022-22085 HIGH
8.4
8 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
9 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
10 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
11 Jun 14, 2022 CVE-2022-22071 HIGH
8.4
12 Jun 14, 2022 CVE-2022-22068 HIGH
8.4
13 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
14 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
15 Jun 14, 2022 CVE-2022-22057 HIGH
8.4
16 Jun 14, 2022 CVE-2021-35121 MEDIUM
6.7
17 Jun 14, 2022 CVE-2021-35120 MEDIUM
6.7
18 Jun 14, 2022 CVE-2021-35119 MEDIUM
5.5
19 Jun 14, 2022 CVE-2021-35118 MEDIUM
6.7
20 Jun 14, 2022 CVE-2021-35116 HIGH
7.7
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:03