Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

29

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-35112 HIGH
8.4
2 Jun 14, 2022 CVE-2021-35104 CRITICAL
9.8
3 Jun 14, 2022 CVE-2021-35100 HIGH
7.5
4 Jun 14, 2022 CVE-2021-35098 MEDIUM
6.7
5 Jun 14, 2022 CVE-2021-35094 HIGH
7.8
6 Jun 14, 2022 CVE-2021-35092 MEDIUM
6.7
7 Jun 14, 2022 CVE-2021-35085 HIGH
7.1
8 Jun 14, 2022 CVE-2021-35084 HIGH
7.1
9 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
10 Jun 14, 2022 CVE-2021-35081 CRITICAL
9.8
11 Jun 14, 2022 CVE-2021-35080 MEDIUM
6.5
12 Jun 14, 2022 CVE-2021-35079 MEDIUM
6.2
13 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
14 Jun 14, 2022 CVE-2021-35072 HIGH
7.8
15 Jun 14, 2022 CVE-2021-35071 MEDIUM
5.5
16 Jun 14, 2022 CVE-2021-30350 HIGH
8.4
17 Jun 14, 2022 CVE-2021-30349 HIGH
8.2
18 Jun 14, 2022 CVE-2021-30346 MEDIUM
6.5
19 Jun 14, 2022 CVE-2021-30345 MEDIUM
6.5
20 Jun 14, 2022 CVE-2021-30344 HIGH
7.5
Showing 20 of 380 Results
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