Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

29

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 13, 2022 CVE-2021-30353 HIGH
7.5
2 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
3 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
4 Jan 13, 2022 CVE-2021-30314 MEDIUM
6.2
5 Jan 13, 2022 CVE-2021-30313 MEDIUM
6.7
6 Jan 13, 2022 CVE-2021-30311 HIGH
7.8
7 Jan 13, 2022 CVE-2021-30307 HIGH
7.5
8 Jan 13, 2022 CVE-2021-30300 HIGH
7.5
9 Jan 13, 2022 CVE-2021-30285 CRITICAL
9.3
10 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
11 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
12 Jan 03, 2022 CVE-2021-30337 HIGH
8.4
13 Jan 03, 2022 CVE-2021-30336 HIGH
8.4
14 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
15 Jan 03, 2022 CVE-2021-30298 HIGH
7.8
16 Jan 03, 2022 CVE-2021-30289 HIGH
7.8
17 Jan 03, 2022 CVE-2021-30282 HIGH
8.4
18 Jan 03, 2022 CVE-2021-30279 HIGH
7.8
19 Jan 03, 2022 CVE-2021-30278 HIGH
7.1
20 Jan 03, 2022 CVE-2021-30276 CRITICAL
9.3
Showing 20 of 380 Results
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