Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

29

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-30342 CRITICAL
9.1
2 Jun 14, 2022 CVE-2021-30341 CRITICAL
9.8
3 Jun 14, 2022 CVE-2021-30339 CRITICAL
9.0
4 Jun 14, 2022 CVE-2021-30334 HIGH
8.4
5 Jun 14, 2022 CVE-2021-30281 HIGH
8.4
6 Apr 01, 2022 CVE-2021-35106 HIGH
7.8
7 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
8 Apr 01, 2022 CVE-2021-35103 HIGH
7.8
9 Apr 01, 2022 CVE-2021-35088 CRITICAL
9.1
10 Apr 01, 2022 CVE-2021-30333 HIGH
7.8
11 Apr 01, 2022 CVE-2021-30331 MEDIUM
5.5
12 Apr 01, 2022 CVE-2021-1950 HIGH
7.8
13 Apr 01, 2022 CVE-2021-1942 CRITICAL
9.3
14 Feb 11, 2022 CVE-2021-35077 HIGH
8.4
15 Feb 11, 2022 CVE-2021-35069 HIGH
7.8
16 Feb 11, 2022 CVE-2021-35068 CRITICAL
9.8
17 Feb 11, 2022 CVE-2021-30325 MEDIUM
6.7
18 Feb 11, 2022 CVE-2021-30324 MEDIUM
6.7
19 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
20 Feb 11, 2022 CVE-2021-30317 CRITICAL
9.3
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