Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

399

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

48

CISA Actively Exploited :

4

Last Vulnerability Seen :

Oct. 06, 2026
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-35104 HIGH
10.0
2 Jun 14, 2022 CVE-2021-35100 HIGH
7.8
3 Jun 14, 2022 CVE-2021-35098 MEDIUM
6.7
4 Jun 14, 2022 CVE-2021-35094 HIGH
7.8
5 Jun 14, 2022 CVE-2021-35092 MEDIUM
6.7
6 Jun 14, 2022 CVE-2021-35085 HIGH
7.1
7 Jun 14, 2022 CVE-2021-35084 HIGH
7.1
8 Jun 14, 2022 CVE-2021-35083 HIGH
9.4
9 Jun 14, 2022 CVE-2021-35081 HIGH
10.0
10 Jun 14, 2022 CVE-2021-35080 MEDIUM
6.5
11 Jun 14, 2022 CVE-2021-35079 MEDIUM
6.2
12 Jun 14, 2022 CVE-2021-35078 HIGH
7.8
13 Jun 14, 2022 CVE-2021-35072 HIGH
7.8
14 Jun 14, 2022 CVE-2021-35071 MEDIUM
5.5
15 Jun 14, 2022 CVE-2021-30350 HIGH
8.4
16 Jun 14, 2022 CVE-2021-30349 HIGH
8.2
17 Jun 14, 2022 CVE-2021-30346 MEDIUM
6.5
18 Jun 14, 2022 CVE-2021-30345 MEDIUM
6.5
19 Jun 14, 2022 CVE-2021-30344 HIGH
7.8
20 Jun 14, 2022 CVE-2021-30342 CRITICAL
9.1
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