Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

392

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

37

CISA Actively Exploited :

4

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
2 Jun 14, 2022 CVE-2021-35081 CRITICAL
9.8
3 Jun 14, 2022 CVE-2021-35080 MEDIUM
6.5
4 Jun 14, 2022 CVE-2021-35079 MEDIUM
6.2
5 Jun 14, 2022 CVE-2021-35078 HIGH
7.5
6 Jun 14, 2022 CVE-2021-35072 HIGH
7.8
7 Jun 14, 2022 CVE-2021-35071 MEDIUM
5.5
8 Jun 14, 2022 CVE-2021-30350 HIGH
8.4
9 Jun 14, 2022 CVE-2021-30349 HIGH
8.2
10 Jun 14, 2022 CVE-2021-30346 MEDIUM
6.5
11 Jun 14, 2022 CVE-2021-30345 MEDIUM
6.5
12 Jun 14, 2022 CVE-2021-30344 HIGH
7.5
13 Jun 14, 2022 CVE-2021-30342 CRITICAL
9.1
14 Jun 14, 2022 CVE-2021-30341 CRITICAL
9.8
15 Jun 14, 2022 CVE-2021-30339 CRITICAL
9.0
16 Jun 14, 2022 CVE-2021-30334 HIGH
8.4
17 Jun 14, 2022 CVE-2021-30281 HIGH
8.4
18 Apr 01, 2022 CVE-2021-35106 HIGH
7.8
19 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
20 Apr 01, 2022 CVE-2021-35103 HIGH
7.8
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